Fremont, CA, February 13, 2023 – Avalanche Technology, the leader in next generation MRAM technology announced today support for Firmware Over-The-Air (FOTA) updates and multiple code images for advanced AMD adaptive SoC platforms used in space-based applications. Leveraging Avalanche’s disruptive Gen 3 Space Grade Dual QSPI Persistent SRAM (P-SRAM™) family which has robust, yet flexible write protection schemes and shipping in densities up to 8Gb, these advanced satellite architectures can now mirror the simplicity of terrestrial systems.
Common hardware platforms that can support advanced processing in an adaptive way are required to address the widespread modernization needs of defense and satellite systems. AMD Versal™ and Kintex™ UltraScale™ adaptive SoC devices provide that versatile backbone, but it needs to be supported by memory architectures that are also versatile enough to changing mission requirements. Hi-Rel system designers have been converging on the use of Avalanche Technology’s Gen 3 Space Grade High Density P-SRAM solutions for SWaP-optimized space architectures, leveraging its resilience, reliability, endurance, and density to consolidate what has historically been a heavily partitioned, complex combination of less resilient memory types. More recently, the Gen 3 Dual QSPI PSRAM family has been hailed by industry as the silver bullet for utilizing these capabilities to boot these adaptive SoCs, which require large code image sizes. With pin compatible densities of 1Gb to 8Gb, there is ample support for multiple configuration images, an RTOS and space for execution, and now also allows in field/orbit firmware upgradability for maximized mission versatility.
Firmware Over-The-Air is a capability that allows operators of connected devices to update their firmware versions remotely and seamlessly, without the need for direct physical access to the device. This ability to refresh critical code attributes in deployed systems in a secure and reliable way is something we’ve all been enjoying for years on earth, initially used in automotive applications and cell phones and in more recent years, IoT. Fixing bugs and adding new capabilities securely in a deployed system has revolutionized terrestrial industries in dramatic ways but challenges and complexities associated with space-based applications have prevented broad use of FOTA, until now.
“Few applications could benefit from increased autonomy and versatility as much as those in space, where physical access is unrealistic and mission hardware that is not reconfigurable is unscalable and uncompetitive,” said Minal Sawant, senior director of Aerospace and Defense Vertical Market, AMD. “AMD is committed to providing breakthrough solutions that deliver the reliability, performance, and versatility to address evolving aerospace and defense system needs. Having ecosystem partners like Avalanche support multiple mission images and FOTA for AMD adaptive SoC platforms helps ensures ultimate versatility for changing mission requirements.”
“As the aerospace and defense industry works to accelerate the pace of innovation while balanced with reliability, environmental resilience and flexibility, the use of FPGA-based adaptive SoCs will be crucial. The AMD Versal and Kintex UltraScale adaptive SoCs and others are providing that leap in high performance processing the industry needs to address evolving challenges”, said Danny Sabour, Vice President of Marketing and Business Development at Avalanche Technology. “Avalanche is delighted to provide enabling companion solutions to the AMD adaptive SoC portfolio to further magnify system versatility and scalability. By leveraging Avalanche’s Gen 3 Space Grade Dual QSPI P-SRAM™ family, known to offer SWaP optimized architectures, not only does the scalability apply to density and radiation classification, but with the addition of support for FOTA and multiple mission images, hardware platforms can now evolve with the mission needs.”
Supporting Resources:
Avalanche Gen 3 Space Grade Serial Dual QSPI Persistent SRAM
The Gen 3 Space Grade Dual QSPI series is offered as a standard product in density options from 1Gb to 8Gb and has serial bus interface with byte addressability with no wear leveling. Designed for High Reliability with multibit error correction and industry leading 1016 write cycle endurance, data is always non-volatile. The devices are offered in compact 96-ball FBGA (20mm x 20mm) solutions with the extended (-40°C to 125°C) operating temperature range and a JEDEC qualification flow, where every device goes through a 48-hour burn in before being shipped to customers. There are additional qualification screening options available through partners. More information about Avalanche P-SRAM products is available at https://www.avalanche-technology.com/products/discrete-mram/space/.
About Avalanche Technology
Avalanche Technology Inc. is the leader in next generation Perpendicular STT-MRAM technology, accepted as the front-runner to replace traditional Flash and SRAM for unified memory architectures in future SOC systems, delivering high performance and low power at 55, 40, 28 and 22nm with scalability beyond 14nm. With a proven STT-MRAM portfolio at multiple geometry nodes combined with an intellectual property portfolio of over 300 patents and applications, Avalanche Technology is delivering on the promise of enabling the next generation of scalable unified memory architecture for industrial, IoT, aerospace and storage applications, making it the true “Next Generation MRAM Company.” For more information, visit us online at https://www.avalanche-technology.com.
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